热管理器件生产厂家_热管理器件_PDF资料功能描述第5页信息-威尔健半导体

型号	制造商	描述	参考价格	库存数量
HSS-B20-NPS-01	CUI Devices	HEATSINK TO-220 4.2W ALUMINUM PDF数据手册	暂无价格	参考库存:4617
HSE-B20250-040H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25 PDF数据手册	暂无价格	参考库存:4119
HSE-B18254-035H-00	CUI Devices	HEAT SINK, EXTRUSION, TO-218, 25 PDF数据手册	暂无价格	参考库存:4020
HSS-B20-NP	CUI Devices	HEATSINK TO-220 4W ALUMINUM PDF数据手册	暂无价格	参考库存:3406
HSE-B254-04H	CUI Devices	HEAT SINK, EXTRUSION, TO-220/TO- PDF数据手册	暂无价格	参考库存:3172
HSS-B20-0953H-01	CUI Devices	HEATSINK TO-220 2.3W ALUMINUM PDF数据手册	暂无价格	参考库存:3930
HSE-B20254-035H-02	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25 PDF数据手册	暂无价格	参考库存:2874
HSS-B20-061H-02	CUI Devices	HEATSINK TO-220 2.9W ALUMINUM PDF数据手册	暂无价格	参考库存:3114
HSS-B20-0953H-02	CUI Devices	HEATSINK TO-220 2.9W ALUMINUM PDF数据手册	暂无价格	参考库存:2828
HSS-B20-0503H	CUI Devices	HEATSINK TO-220 4.6W ALUMINUM PDF数据手册	暂无价格	参考库存:2293
HSS-B20-NP-07	CUI Devices	HEATSINK TO-220 2.3W ALUMINUM PDF数据手册	暂无价格	参考库存:2861
HSS-B20-0635H-01	CUI Devices	HEATSINK TO-220 2.7W ALUMINUM PDF数据手册	暂无价格	参考库存:2200
HSE-B20250-045H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 50 PDF数据手册	暂无价格	参考库存:2163
HSE-B250-04H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25 PDF数据手册	暂无价格	参考库存:1411
HSE-B18254-035H	CUI Devices	HEAT SINK, EXTRUSION, TO-218, 25 PDF数据手册	暂无价格	参考库存:1294
HSE-B2111-038	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25 PDF数据手册	暂无价格	参考库存:6333
HSS-B20-NP-04	CUI Devices	HEATSINK TO-220 6.5W ALUMINUM PDF数据手册	暂无价格	参考库存:5141
HSS-B20-061H	CUI Devices	HEATSINK TO-220 4W ALUMINUM PDF数据手册	暂无价格	参考库存:4916
HSS-B20-NP-12	CUI Devices	HEATSINK TO-220 6.8W ALUMINUM PDF数据手册	暂无价格	参考库存:5988
HSE-B20254-056H	CUI Devices	HEAT SINK, EXTRUSION, TO-220, 25 PDF数据手册	暂无价格	参考库存:3655

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过虑结果：105 品牌=CUI Devices 清除筛选